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West System 411 Microsphere Blend is a low density filler used as a thickening agent with West System epoxy to create a lightweight filling putty, with excellent filleting characteristics. West System epoxy thickened with 411 Microsphere Blend is also used as a low density adhesive for edge-gluing cedar and DuraKore for strip plank construction.

The inclusion of 411 Microsphere Blend into the resin and hardener mix, essentially produces a cellular structure with some loss of tensile and compressive strength, but flexibility remains excellent. Pot-life of the epoxy mixture decreases with the inclusion of the Microsphere Blend although overall cure rate in thin layers is little changed.

NOTE:Asia Pacific Filler List compare to US Filler List, please refer to this LINK.

For more product information, please refer to Product Data Sheet.